Welcome! Semiconductor Notes are one-page reviews of the variety of topics of current interest in semiconductor science and engineering. SN-1 High-k? Low-k Dielectrics? What does it mean "high-k" and "low-k" dielectric and why do we need them in cutting edge silicon integrated circuits? SN-2 Lamp Cleaning Lamp irradiation can remove organic contaminants from semiconductor surface. SN-3 Mist Deposition Alternative to spin-on method of thin film formation using liquid source material. For technical information: http://www.primaxxinc.com/products.html SN-4 Transistor (R)Evolution More then evolution of MOSFET technology is needed to keep the progress going. SN-5 Silicon-On-Insulator (SOI) SOI wafers will replace conventional bulk silicon wafers in cutting edge applications. SN-6 Fabrication of SOI Wafers Fabrication of the wafer in which amorphous insulator is "buried" underneath very thin layer of high quality single-crystal Si is a challenging task. SN-7 Strained Semiconductor Films Mobility of electrons in "strained" semiconductors is higher than in conventional "relaxed" semiconductors; incorporation of strained layers results in faster semiconductor devices. SN-8 Supercritical Fluid Cleaning The fourth state of matter to the rescue in advanced wafer cleaning technology. SN-9 Gallium Nitride Material which helped overcome barriers in semiconductor photonics. SN-10 Silicon Carbide May solve problems not only in high-power electronics. SN-11 Organic Semiconductors A new bread of semiconnductor materials. SN-12 Immersion Lithography Helps pushing limits of photolithography. SN-13 Crystal Structure Spatial distribution of atoms in the lattice plays important role in defining properties of semiconductors. SN-14 Surface Contaminants Key contaminants in the semiconductor device manufacturing environment. SN-15 Cleaning in Semiconductor Manufacturing Overview of wafer cleaning technology. SN-16 Wet Cleaning Technology - Chemistry Basics regarding wet cleaning chemistries may not seem to change much, yet, wet cleans undergo drastic modifications. SN-17 Wet Cleaning Technology - Implementation Methods of delivering liquid cleaning chemistries to the wafer surface. SN-18 Dry Cleaning Technology In some applications may replace or supplement conventional wet cleaning methods. SN-19 Surface Conditioning Methods of imposing a desired chemical composition of semiconductor surface. SN-20 Gate Oxide Breakdown Briefly about breakdown fundamentals and key measuring methods: TZDB and TDDB. SN-21 Gettering Forcing impurities and defects away from the top surface of the wafer. SN-22 Silicon-On-Sapphire, SOS The revived SOS substrates show great promise in RF applications. SN-23 Comparison of Silicides Formation of the silicide is considered and key silicides are compared. SN-24 MEMS Release An important process in MEMS manufacturing.
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