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Welcome!
Semiconductor Notes are one-page reviews of the variety of topics of current interest in semiconductor science and engineering.

SN-1 High-k? Low-k Dielectrics?
What does it mean "high-k" and "low-k" dielectric and why do we need them in cutting edge silicon integrated circuits?

SN-2 Lamp Cleaning
Lamp irradiation can remove organic contaminants from semiconductor surface.

SN-3 Mist Deposition
Alternative to spin-on method of thin film formation using liquid source material.
For technical information: http://www.primaxxinc.com/products.html

SN-4 Transistor (R)Evolution
More then evolution of MOSFET technology is needed to keep the progress going.

SN-5 Silicon-On-Insulator (SOI)
SOI wafers will replace conventional bulk silicon wafers in cutting edge applications.

SN-6 Fabrication of SOI Wafers
Fabrication of the wafer in which amorphous insulator is "buried" underneath very thin layer of high quality single-crystal Si is a challenging task.

SN-7 Strained Semiconductor Films
Mobility of electrons in "strained" semiconductors is higher than in conventional "relaxed" semiconductors; incorporation of strained layers results in faster semiconductor devices.

SN-8 Supercritical Fluid Cleaning
The fourth state of matter to the rescue in advanced wafer cleaning technology.

SN-9 Gallium Nitride
Material which helped overcome barriers in semiconductor photonics.

SN-10 Silicon Carbide
May solve problems not only in high-power electronics.

SN-11 Organic Semiconductors
A new bread of semiconnductor materials.

SN-12 Immersion Lithography
Helps pushing limits of photolithography.

SN-13 Crystal Structure
Spatial distribution of atoms in the lattice plays important role in defining properties of semiconductors.

SN-14 Surface Contaminants
Key contaminants in the semiconductor device manufacturing environment.

SN-15 Cleaning in Semiconductor Manufacturing
Overview of wafer cleaning technology.

SN-16 Wet Cleaning Technology - Chemistry
Basics regarding wet cleaning chemistries may not seem to change much, yet, wet cleans undergo drastic modifications.

SN-17 Wet Cleaning Technology - Implementation
Methods of delivering liquid cleaning chemistries to the wafer surface.

SN-18 Dry Cleaning Technology
In some applications may replace or supplement conventional wet cleaning methods.

SN-19 Surface Conditioning
Methods of imposing a desired chemical composition of semiconductor surface.

SN-20 Gate Oxide Breakdown
Briefly about breakdown fundamentals and key measuring methods: TZDB and TDDB.

SN-21 Gettering
Forcing impurities and defects away from the top surface of the wafer.

SN-22 Silicon-On-Sapphire, SOS
The revived SOS substrates show great promise in RF applications.

SN-23 Comparison of Silicides
Formation of the silicide is considered and key silicides are compared.

SN-24 MEMS Release
An important process in MEMS manufacturing.




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