Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
wire bonding  part of the chip assembly process in which very thin (about 30 micrometer in diameter) gold wire is used to connect chip and the package; bonding pads at the perimeter of the chip are connected to the lead connections in the package; typically uses combination of thermal compression and ultrasonic motion.
assembly  process in which fully processed semiconductor device/circuit in the form of a chip is mechanically and electrically connected to the package.
package  housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.