Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


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Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
wire bonding  part of the chip assembly process in which very thin (about 30 micrometer in diameter) gold wire is used to connect chip and the package; bonding pads at the perimeter of the chip are connected to the lead connections in the package; typically uses combination of thermal compression and ultrasonic motion.
assembly  process in which fully processed semiconductor device/circuit in the form of a chip is mechanically and electrically connected to the package.
package  housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.



This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.


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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.