Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
via first,  in 3D packaging TSV is processed prior to wafer (chip) bonding.
via 7 hole etched in the interlayer dielectric which is then filled with metal, usually tungsten, to provide vertical connection between stacked up interconnect metal lines.
via last,  in 3D packaging TSV is processed after wafer (chip) thinning and bonding.
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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.