Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
ultrasonic agitation, ultrasonic scrubbing  used to enhance particles removal from wafer surface; sonic energy at the frequency range of 10-100 kHz is applied to the liquid in which wafers are immersed; not as effective, and hence not as commonly used, as megasonic scrubbing.
megasonic agitation, megasonic scrubbing  used to enhance particle removal from wafer surface by sonic pressure; megasonic energy at the frequency in 500-1000 kHz range is applied to the liquid (typically APM cleaning solution) in which wafers are immersed; more effective and less potentially damaging to the wafer (reduced cavitation) than ultrasonic agitation; standard feature in the immersion cleaning tools.

Reference: Akrion, Inc.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.