Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
ultrasonic agitation, ultrasonic scrubbing  used to enhance particles removal from wafer surface; sonic energy at the frequency range of 10-100 kHz is applied to the liquid in which wafers are immersed; not as effective, and hence not as commonly used, as megasonic scrubbing.
megasonic agitation, megasonic scrubbing  used to enhance particle removal from wafer surface by sonic pressure; megasonic energy at the frequency in 500-1000 kHz range is applied to the liquid (typically APM cleaning solution) in which wafers are immersed; more effective and less potentially damaging to the wafer (reduced cavitation) than ultrasonic agitation; standard feature in the immersion cleaning tools.

Reference: Akrion, Inc.
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