Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


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Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
post-CMP cleaning  particularly demanding cleaning routine needed to remove products of CMP process; wet cleaning involving mechanical interactions (brush scribbing).
brush scrubbing  cleaning of semiconductor surfaces using rotating brushes; used to remove heavy residues which cannot be removed without mechanical interactions; used in post-CMP wafer cleaning.
slurry  a liquid containing suspended abrasive component; used for lapping, polishing and grinding of solid surfaces; key element of CMP processes.
wet cleaning  process of contaminants removal from the wafer surface in the liquid-phase; prevailing cleaning method in semiconductor manufacturing; wet cleaning chemistries are selected to form soluble compounds of surface contaminants; often enhanced by megasonic agitation; always followed by deionized water rinse and dry cycle.

Reference: Akrion, Inc.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.



This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.


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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.