Semiconductor Glossary, Developed Semi OneSource.
Google
 



Check out the new SemiconductorGlossary.com weBLOG!

Semiconductor Glossary book, click here to see new prices!


With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Sponsors


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


Search For Term

Term (Index) Definition
packaging  process of enclosing of the semiconductor chip or discreet device in the package.
package  housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.
Term (Index) Definition
BBUL packaging  "Bumpless Build-Up Layer" technology, or BBUL packaging; BBUL "grows" the package around the silicon, resulting in thinner, high-performance, consuming less power processors; this is in contrast to current practice of manufacturing the processor die separately and later bonding it to the package.
package  housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.
Hit Count=

Back To Top! 

Back To Home!






Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.



This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.


Hit Count=
Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.