Semiconductor Glossary, Developed Semi OneSource.
Google
 


Check out the new SemiconductorGlossary.com weBLOG!



With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.












Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


Search For Term

Term (Index) Definition
numerical aperture, NA  parameter defining geometry of the objective lens used in projection printing in photolithography; determines lens' ability to collect light diffracted from a mask/reticle; attempts are continuously made to keep NA as high as possible (see immersion lithography for instance).
projection printing  exposure technique used in photolithography in which mask (reticle) image is projected on the surface of the wafer through the complex system of image correcting lenses (think of an old fashion slide projector in which slide is the mask and screen is a surface of the wafer); assures the highest resolution among all exposure methods; implemented using steppers in which resist on the surface of the wafer is exposed step-by-step (step and repeat process) as opposed to full-field exposure in which the entire wafer is exposed in one shot.

Reference: See Semiconductor Notes for more information
immersion lithography  photolithography techniques in which space between the final projection lens and the wafer in the exposure tool is filled with water rather than air; use of medium featuring higher refractive index n ( n=1 for air while n=1.44 for water) increases numerical aperture (NA) of the optical lithography tool, and hence, increases resolution of the pattern transfer process.

Reference: See Semiconductor Notes for more information
stepper  resist exposure tool commonly used in photolithograhy; works using projection printing; in contrast to full-field exposure tools stepper exposes through the remotely located reticle only part of the wafer and repeats the process ("step-and-repeat") as many time as needed to expose entire wafer.
Hit Count=

Back To Top! 

Back To Home!







Hit Count=
Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.