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Term (Index) Definition
metallization  formation of metal contacts and interconnects in the manufacturing of semiconductor devices.
Physical Vapor Deposition, PVD  deposition of thin film occurs through physical transfer of material (e.g. thermal evaporation and sputtering)from the source to the substrate; chemical composition of deposited material is not altered in the process.
Term (Index) Definition
multilayer metallization  metal lines comprising of two or more different metals deposited on top of each other and each serving different purpose; for instance, layer of aluminum will assure low resistivity of metal contact while underlying titanium nitride will act as a barrier preventing aluminum spiking.
barrier metal  thin layer of metal, e.g. TiN, sandwiched between other metal and semiconductor (or insulator) to prevent potentially harmful interactions between these two, e.g. spiking.
Term (Index) Definition
multilevel metallization  see "multilevel interconnect"
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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.