Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
megasonic cleaning  wafer cleaning process which uses sonic waves generated in cleaning solution to increase efficiency of particle removal process.

Reference: Akrion, Inc.
APM  Ammonia hydroxide-hydrogen Peroxide-water Mixture; typically 0.25:1:5; same as SC1 and RCA-1; cleaning solution used primarily to remove particles from the surface; also capable of removing surface organics; strong solutions can etch/roughen silicon surface; forms chemical oxide (hydrophylic surface)on Si surface; applied at temperature between 40 oC and 70 oC; typically combined with megasonic agitation.
megasonic agitation, megasonic scrubbing  used to enhance particle removal from wafer surface by sonic pressure; megasonic energy at the frequency in 500-1000 kHz range is applied to the liquid (typically APM cleaning solution) in which wafers are immersed; more effective and less potentially damaging to the wafer (reduced cavitation) than ultrasonic agitation; standard feature in the immersion cleaning tools.

Reference: Akrion, Inc.
wet bench  typically fully automatic process tool used to carry out wet cleaning and etching operations in semiconductor processing; commonly includes several tanks each containing either cleaning/etching solution or deionized rinsing water in which wafers are immersed in predetermined sequence; typically includes also drying module.

Reference: Akrion, Inc. SemiOneSource,Notes
particle removal  process designed to remove particles from the wafer surface; carried out using wet cleaning (APM) with megasonic agitation; particle removal in the gas phase is less effective.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.