Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
mechanical mask  thin, yet rigid, sheet of metal with adequately shaped holes through which material can be deposited directly on the wafer surface; deposited geometries reflect shape of the openings in the sheet metal, but resolution of the process is very low.
evaporation  common technique used to deposit thin film materials; material to be deposited is heated in vacuum, 10-6 Torr - 10-7 Torr range, until it melts and starts evaporating; vapor of material is condensing on the cooler substrate exposed to the vapor; common technique in thin film metal deposition; not suitable for high melting point materials; one of the PVD (Physical Vapor Deposition) methods of thin film formation.
mask  device used to shape desired geometries on the surface of the wafer; Examples: (i)photomask; allows selective irradiation of resist on the wafer surface by blocking irradiation in selected areas; consist of opaque (non-transparent to given wavelengths) and blank (transparent) parts; in photolithography chrome, and quartz respectively; (ii)mechanical (shadow) mask; a thin sheet of metal with properly shaped holes; sometimes used to define crude geometries on the surface of the wafer during physical vapor depositions.
sputtering, sputter deposition  bombardment of solid (target) by high energy chemically inert ions (e.g. Ar+)extracted from plasma; causes ejection of atoms from the target which are then re-deposited on the surface of the substrate purposely located in the vicinity of the target; common method of Physical Vapor Deposition (PVD) of metals and oxides.
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Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.