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Term (Index) Definition
lateral etching  etahcing taking place in the direction parallel to the wafer surface; undesired, and hence avoided in the case when very tight vertical geometrical features are defined by etching; desired and used in select MEMS etching applications.
anisotropic etch  etch in which etch rate in the direction normal to the surface is much higher than in direction parallel to the surface; no undercutting i.e. lateral distortion of pattern is minimized; needed to define very tight geometries.
isotropic etch  etch in which rate of etching reaction is the same in any direction; non-directional.
MEMS  Micro Electro Mechanical Systems micromachined in silicon; typically integrated with electronic microcircuits; generally fall into two categories of microsensors and microactuators; depending on application operation based on electrostriction, or electromagnetic, thermoelastic, piezoelectric, or piezoresistive effect.
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