Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.












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Term (Index) Definition
lamp heating  use of high-power IR lamps for the purpose of increasing wafer temperature; in contrats to other methods of thermal processing (see furnace)allows very brief wafer exposure to very high temparature (typically not exceeding 1100 oC); low thermal budget process.
IR  infrared (radiation); wavelength from 0.7 micrometer to 15 micrometer; invisible; often used for heating purposes.
RTP  Rapid Thermal Processing; general term describing type of the process in which temperature of the wafer is rapidly increased by radiant heating from high-power halogen-quartz lamps; low-thermal budget process; useful in several applications in semiconductor device processing in which high temperature exposure is needed, but transfer of the large amount of thermal energy to the wafer is not desired .
thermal budget  term defines total amount of thermal energy transferred to the wafer during the given elevated temperature operation; proportional to temperature and duration of the process; low thermal budget is desired in ultra-small IC manufacturing to prevent dopant redistribution; low thermal budget is possible even at a very high temperature if time of the process is very short (can be as short as few seconds); RTP.
furnace  tool used in semiconductor device manufacturing to process wafers at high temperature in the ambient of strictly controlled composition; uses heavy heating coils, and hence, does not allow rapid changes of wafer temperature; high thermal budget process; RTP is a low thermal budget alternative.
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