Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
hydrogen peroxide, H2O2  liquid; very strong oxidizer; commonly used in cleaning solutions.
APM  Ammonia hydroxide-hydrogen Peroxide-water Mixture; typically 0.25:1:5; same as SC1 and RCA-1; cleaning solution used primarily to remove particles from the surface; also capable of removing surface organics; strong solutions can etch/roughen silicon surface; forms chemical oxide (hydrophylic surface)on Si surface; applied at temperature between 40 oC and 70 oC; typically combined with megasonic agitation.
HPM  hydrochloric acid-hydrogen peroxide-water mixture typically 1:1:5; same as SC2 and RCA2; cleaning solution used primarily to remove metallic contaminants; gradually replaced with alternative recipes such as those involving very weak solutions of HF:HCl in water.
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