Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
hydrochloric acid, HCl  used in cleaning solutions (HPM or HF/HCl mixture) to complex metallic contaminants; gaseous HCl may be added to oxygen during thermal oxidation of Si for the same purpose.
cleaning  process of removing contaminants (particles as well as metallic and organic) from the surface of the wafer; can be implemented using liquid chemicals (wet cleaning) of gases (dry cleaning).

Reference: Akrion, Inc.
HPM  hydrochloric acid-hydrogen peroxide-water mixture typically 1:1:5; same as SC2 and RCA2; cleaning solution used primarily to remove metallic contaminants; gradually replaced with alternative recipes such as those involving very weak solutions of HF:HCl in water.
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Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.