Semiconductor Glossary, Developed Semi OneSource.
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Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
evaporation  common technique used to deposit thin film materials; material to be deposited is heated in vacuum, 10-6 Torr - 10-7 Torr range, until it melts and starts evaporating; vapor of material is condensing on the cooler substrate exposed to the vapor; common technique in thin film metal deposition; not suitable for high melting point materials; one of the PVD (Physical Vapor Deposition) methods of thin film formation.
Physical Vapor Deposition, PVD  deposition of thin film occurs through physical transfer of material (e.g. thermal evaporation and sputtering)from the source to the substrate; chemical composition of deposited material is not altered in the process.
Term (Index) Definition
electron beam (e-beam) evaporation  material is evaporated as a result of highly localized heating by bombardment with high energy electrons generated in an electron gun and directed toward the surface of source material confined in the crucible; evaporated material is very pure; bombardment of metal with electrons is accompanied by generation of low intensity X-rays which may create defects in the oxide present on the surface of the substrate; typically, an anneal is needed to eliminate those defects.
Physical Vapor Deposition, PVD  deposition of thin film occurs through physical transfer of material (e.g. thermal evaporation and sputtering)from the source to the substrate; chemical composition of deposited material is not altered in the process.
Term (Index) Definition
filament evaporation  thermal evaporation; source material is attached to the filament (refractory metal) and melted by high current flowing through the filament; alternative approach is to use a "boat" made out of refractory metal which contains material to be evaporated; current sufficient to melt a source material is passed through the boat.
electron beam (e-beam) evaporation  material is evaporated as a result of highly localized heating by bombardment with high energy electrons generated in an electron gun and directed toward the surface of source material confined in the crucible; evaporated material is very pure; bombardment of metal with electrons is accompanied by generation of low intensity X-rays which may create defects in the oxide present on the surface of the substrate; typically, an anneal is needed to eliminate those defects.
evaporation  common technique used to deposit thin film materials; material to be deposited is heated in vacuum, 10-6 Torr - 10-7 Torr range, until it melts and starts evaporating; vapor of material is condensing on the cooler substrate exposed to the vapor; common technique in thin film metal deposition; not suitable for high melting point materials; one of the PVD (Physical Vapor Deposition) methods of thin film formation.
Term (Index) Definition
reactive evaporation  same concept as reactive sputtering.
evaporation  common technique used to deposit thin film materials; material to be deposited is heated in vacuum, 10-6 Torr - 10-7 Torr range, until it melts and starts evaporating; vapor of material is condensing on the cooler substrate exposed to the vapor; common technique in thin film metal deposition; not suitable for high melting point materials; one of the PVD (Physical Vapor Deposition) methods of thin film formation.
reactive sputtering  sputter deposition process in which species sputtered off the target material are chemically reacting with other species in the gas mixture to form a compound to be deposited; e.g. sputtering of Si in plasma containing oxygen will result in deposition of SiO2.
Term (Index) Definition
thermal evaporation  see filament evaporation
filament evaporation  thermal evaporation; source material is attached to the filament (refractory metal) and melted by high current flowing through the filament; alternative approach is to use a "boat" made out of refractory metal which contains material to be evaporated; current sufficient to melt a source material is passed through the boat.
Physical Vapor Deposition, PVD  deposition of thin film occurs through physical transfer of material (e.g. thermal evaporation and sputtering)from the source to the substrate; chemical composition of deposited material is not altered in the process.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.



This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.


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Created and operated by J. Ruzyllo. Copyright © J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.