Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.












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Term (Index) Definition
electroplating  thin layer of metal is plated on the surface of the biased wafer immersed in the electrolyte containg metal ions; seed layer may have to be formed first; method used in IC manufacturing to deposit copper.
copper, Cu  (i) metal of choice for interconnects in advanced ICs; resistivity the lowest among metals - 1.7 µohm-cm; advantages over aluminum: no electromigration and lower resistivity; (ii) defect causing contaminant if allowed to penetrate silicon; very fast diffusant in silicon; results in reduced lifetime of minority carriers.
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