Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.












Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
die  a single piece of semiconductor containing entire integrated circuit which has not yet been packaged; equivalent term - chip.
chip  piece of semiconductor wafer containing the entire circuit.
Term (Index) Definition
die attachment  process of attaching die (chip) to the package.
Term (Index) Definition
die separation  process of cutting wafer into dies (chips) each containing a complete semiconductor device/circuit.
dicing  process of cutting semiconductor wafer into individual chips following completion of device (both discreet and integrated) manufacturing; in the case of large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallographic planes using high precision saw with ultra-thin diamond blade.
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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.