Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.












Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
chip  piece of semiconductor wafer containing the entire circuit.
die  a single piece of semiconductor containing entire integrated circuit which has not yet been packaged; equivalent term - chip.
Term (Index) Definition
flip chip technology  assembly method in which chip is attached with its surface down directly to the board without any wire bonding; chip has appropriately pre-processed bond pads.
wire bonding  part of the chip assembly process in which very thin (about 30 micrometer in diameter) gold wire is used to connect chip and the package; bonding pads at the perimeter of the chip are connected to the lead connections in the package; typically uses combination of thermal compression and ultrasonic motion.
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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.