Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
brush scrubbing  cleaning of semiconductor surfaces using rotating brushes; used to remove heavy residues which cannot be removed without mechanical interactions; used in post-CMP wafer cleaning.
CMP  Chemical Mechanical Polishing, Chemical Mechanical Planarization, method of removing layers of solid by chemical-mechanical polishing carried out for the purpose of surface planarization and definition of metal interconnect pattern; key process in back-end of line IC manufacturing.
scrub, scrubbing  removal of heavy contaminants from the wafer surface by means of mechanical interactions (brush scrubbing); used primarily after chemical-mechanical planarization (CMP) operations.
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