Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
assembly  process in which fully processed semiconductor device/circuit in the form of a chip is mechanically and electrically connected to the package.
dicing  process of cutting semiconductor wafer into individual chips following completion of device (both discreet and integrated) manufacturing; in the case of large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallographic planes using high precision saw with ultra-thin diamond blade.
packaging  process of enclosing of the semiconductor chip or discreet device in the package.
wire bonding  part of the chip assembly process in which very thin (about 30 micrometer in diameter) gold wire is used to connect chip and the package; bonding pads at the perimeter of the chip are connected to the lead connections in the package; typically uses combination of thermal compression and ultrasonic motion.
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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.