Semiconductor Glossary, Developed Semi OneSource.
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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


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Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.


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Term (Index) Definition
Smart Cut   process used to fabricate bonded SOI substrates; before bonding one wafer is implanted with hydrogen to the depth which will determine thickness of an active layer in future SOI wafer; following bonding wafer is subjected to an anneal during which implanted wafer splits along the plane stressed with implanted hydrogen - one section, very thin, remains bonded to the other wafer forming SOI substrate while the other can be re-used in th fabrication of additional SOI substrates. "Smart Cut" is a trademark of S.O.I.TEC, S.A., Grenoble, France.

Reference: See Semiconductor Notes for more information
SIMOX,   Separation by IMplantation of OXygen; common method used to fabricate SOI substrates; oxygen ions are implanted into Si substrate and form a buried oxide layer.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.



This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.


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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.