Semiconductor Glossary, Developed Semi OneSource.
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Term (Index) Definition
Smart Cut   process used to fabricate bonded SOI substrates; before bonding one wafer is implanted with hydrogen to the depth which will determine thickness of an active layer in future SOI wafer; following bonding wafer is subjected to an anneal during which implanted wafer splits along the plane stressed with implanted hydrogen - one section, very thin, remains bonded to the other wafer forming SOI substrate while the other can be re-used in th fabrication of additional SOI substrates. "Smart Cut" is a trademark of S.O.I.TEC, S.A., Grenoble, France.

Reference: See Semiconductor Notes for more information
SIMOX,   Separation by IMplantation of OXygen; common method used to fabricate SOI substrates; oxygen ions are implanted into Si substrate and form a buried oxide layer.
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