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Welcome! The purpose of this site is to give you an instant explanation of key terms and concepts in the area of semiconductor materials, manufacturing and devices.
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A
a , lattice constant AAS abrupt junction, absorption absorption coefficient acceptor access time accumulation activation energy active Si layer ADC adhesion adhesion promoter adsorption aerosol cleaning, AFM AII-BVI, II-VI, semiconductors AIII-BV, III-V, semiconductors AIV-BIV, IV-IV, semiconductors ALCVD AlGaAs aligner alignment alignment mark alloyed junction alternative dielectrics aluminum oxide, alumina, Al2O3 aluminum, conductor, Al aluminum, contaminant, Al ambipolar carrier transport ambipolar semiconductor AMLCD ammonia, NH3 ammonium hydroxide, NH4OH AMOLED amorphous material amorphous Si, a-Si amphoteric dopant analog device analog integrated circuit angstrom, Å anhydrous HF, AHF anisotropic etch anneal anodic oxidation anodization antimony, Sb anti-reflective coating, ARC ® antisite defect APM ArF excimer laser argon, Ar Arhenius plot arsenic, As arsine, AsH3 ashing ASIC assembly ATE Atmospheric Pressure CVD, APCVD Atomic Layer Deposition, ALD Atomic Layer Epitaxy, ALE atomic number Auger electron Auger Electron Spectroscopy, AES Auger recombination, autodoping avalanche breakdown avalanche multiplication avalanche photodetector,
B
back contact Back End Of Line processes, BEOL ballistic transport ballroom cleanroom band offset band-edge lineup, bandgap bandgap engineering BARITT barrel reactor barrier height barrier metal base base punchthrough base punch-through base pushout base transport factor base width basic oxidation, batch process batch reactor BBUL packaging BCCD beam BGA BHF bias-temperature stress biaxial strain, BiCMOS binary semiconductor bipolar device bipolar transistor, BJT bird beak bit BITS blank BNDC boat Body-Centered Cubic, (BCC) cell Boltzmann constant, k Boltzmann statistics , Boltzmann transport equation bonded SOI boron boron penetration bottom antireflective coating, BARC bottom-up processing boundary layer BOX BPSG breakdown breakdown field breakdown voltage breakdown, hard breakdown, soft Bridgman growth Brillouin zone BRT brush scrubbing BST BTS buffer layer buffered oxide etch, BEO bulk CMOS bulk recombination, buried oxide, BOX burn-in
C
cadmium sulfide, CdS, cadmium telluride, CdTe, CAIBE calcium, Ca cantilever loading capacitance-voltage, C-V, measurements capping layer capture cross-section CAR Carbon Doped Oxide, CDO, carbon nanotube Caro clean carrier extraction carrier generation carrier injection CBE CD CDI CDO CEL ceramic package CERDIP CFM chain scission channel channel length channel stop channeling Charge Coupled Device, CCD charge-to-breakdown, Qbd chemical etching chemical oxide chemisorption chip chrome mask CIGS CIM class cleanroom cleaning cleanroom cleaved SOI cluster cluster, linear, cluster, radial' CMOS CMOS inverter CMP CNT cobalt silicide, CoSi2 coldwall reactor collector colloidal semiconductor, common base configuration common base current gain common base cut-off frequency common emitter configuration common emitter current gain common emitter cut-off frequency compensated semiconductor compound semiconductor conduction band conductivity conformal coating constant - current stress, CCS constant voltage stress, CVS constant-source diffusion contact angle, wetting angle contact printing contaminant contamination contamination control continuity equation Contrast Enhanced Layer, CEL COP copper interconnect copper, Cu cost of ownership, COO covalent bond CP-4 etch CPGA CPU, microprocessor Cr, chrome critical dimension, CD crosslinking cross-talk CRT cryogenic aerosol cryogenic pump cryosol spray crystal crystal defects crystal originated pits crystal pulling cubic system current crowding current gain current-voltage, I-V, measurements custom integrated circuit cut-off frequency CVD, Chemical Vapor Deposition Czochralski crystal growth, CZ
D
DAC damascene dangling bond DARC ® DBR DCFL DDE Deal - Grove model Debye length dechanneling, deep depletion deep level deep UV, DUV degenerate semiconductor deionized water, DI water density of states function density of states, denuded zone, DZ depletion depletion mode MOSFET depth of focus, DOF depth profiling design rules DESIRE desorption developer development DFT DHBT DHBT DHF DHFET diamond diamond lattice DIBL diborane, B2H6 dicing die die attachment die separation dielectric dielectric relaxation time diffusant diffused junction diffusion diffusion coefficient, D diffusion current diffusion length diffusion pump diffusion source digital device, digital integrated circuit DIMOS diode DIP direct bandgap semiconductor direct plasma direct recombination direct tunneling discrete device dislocation dispersive medium DLP®, DLT DLTS DMOS, D-MOS donor dopant dopant activation dopant de-activation dopant redistribution dopants of Silicon doping dose double (dual) gate Double-Gate Transistor downstream plasma DPSSL DQN photoresist drain drain engineering drain extension DRAM DRIE drift current drift mobility drift velocity drive in dry cleaning dry etching dry oxidation dry oxide dry pump drying DST, Depleted Substrate Transistor DSW DTMOSFET dual damascene DUV resist
E
Early effect Ebd EBDW Ebers - Moll model EBIC EBL column, ECL ECR ECR plasma edge dislocation, Edge Emitting Light Emitting Diode, EELED EEL EELS EEPROM effective mass Eg Einstein relationship elastic collision, electromigration electron electron affinity electron beam (e-beam) evaporation electron beam (e-beam) heating electron beam (e-beam) lithography, EBL electron beam (e-beam) resist electron beam, e-beam electron gas, 2-dimensional electron gun electron mobility Electron Projection Lithography, EPL electron spin, spin electron-hole pair electronic device electronic grade poly Si electro-optic effect, electroplating elemental semiconductor elementary charge, q elevated drain elevated drain elevated source ellipsometry ELO emitter emitter injection efficiency factor emitter push effect endpoint endpoint detection energy gap, forbidden band, bandgap, Eg enhancement mode MOSFET enhancement techniques EOT, equivalent oxide thickness epitaxial lateral overgrowth, ELO epitaxial layer epitaxy epitaxy by CVD EPR EPROM ESCA ESL ESR (El. Spin Res.) ESR (Eq. Ser. Res.) EST etch anisotropy etch mask etch selectivity etch stop etching, etch EUV, extreme UV EUVL evaporation excess carriers excimer laser exciton excitonic cells, exposure external, extrinsic gettering extrinsic semiconductor extrusion coating
F
Fabry - Perot cavity Face-Centered Cubic, FCC, cell faceting FAMOS FDMOSFET Fermi energy, Fermi level Fermi potential Fermi-Dirac distribution function ferroelectric crystal ferromagnetic semiconductors, FIB Fick's law, Fick field effect Field Effect Transistor, FET field oxide, FOX filament evaporation fill factor FinFET First 45 nm transistor fixed charge fixed charge Fixed Shape Beam, FSB flash memory flat-band voltage, VFB flip chip technology flip-chip bonding float-zone crystal growth, FZ fluorescence, fluorinated oxide fluorine in SiO2 fluorine, F2 fluorine, F2, excimer laser forbidden gap forming gas forward bias FOUP Fourier - Transform Infrared Spectroscopy, FTIR four-point probe Fowler - Nordheim tunneling, F-N FRAM free carrier Frenkel defect Frenkel pair Front End Of Line processes, FEOL FSB FSG FTPL full field full-field camera full-field exposure fully depleted SOI, FD SOI furnace furnace horizontal furnace vertical FUSI FWI
G
g - line lithography GAA, GaAs-on-Si gallium antimonide, GaSb gallium arsenide, GaAs gallium based semiconductors gallium nitride, GaN gallium phosphide, GaP gas-phase mass transfer gate gate capacitance gate contact gate dielectric gate injection gate length gate oxidation, gate oxide gate self-aligned process gate stack GC - MS, gas chromatography generation generation current generation lifetime generation-recombination current germanide, germanides germanium, Ge gettering gettering extrinsic gettering intrinsic GILD global strain, glow discharge GOI GOI or GeOI gown gowning graded junction grain grain boundary graphene, Gummel-Poon model Gunn diode, TED Gunn effect
H
hafnium oxide, HfO2 hafnium silicate, HfSiO4 halbleiter Hall effect halo implantation, handotai hard bake hard breakdown HBT HDIS' HDP, High Density Plasma HDP-CVD heavily charged ion, HCI HEED helicon plasma HEMT Henry law HEPA filter heteroepitaxy hetero-integration, heterojunction HEXFET hexode etcher HFET HFL, HF-last HIGFET high angle implantation high current implantor high-frequency C-V high-k dielectric high-pressure Hg lamp HIPOX HK+MG HKMG HMDS hole hole mobility homoepitaxy homojunction homopolar bond hopping horizontal furnace hot carrier diode, hot electron hot plate hotwall reactor HPM HREM HRTEM HSQ HVAC hybrid clean hybrid IC hybrid-pi model hydrochloric acid, HCl hydrofluoric acid, HF hydrogen peroxide, H2O2 hydrogen reduction hydrogen termination hydrogenated a-Si hydrophilic surface hydrophobic surface
I
i - line lithography I/O, IO I2L IBD ICP ICP MS ideal MOS ideality factor IGBT IGFET ILD, Inter-Layer Dielectric imaging resist IMD IMEC clean immersion cleaning immersion lithography impact ionization IMPATT diode implantation damage implantation dose implantation energy implantor in situ doping in situ monitoring indirect bandgap semiconductor indirect recombination indium (In) based semiconductors inductive heating inelastic collision, infrared detector ingot InP, indium phosphide InSb, indium antimonide insulator integrated bipolar transistor integrated circuit, IC integrated device integrated processing interconnect interconnect density, interface trap internal emission interstitial interstitial diffusion intrinsic Fermi level intrinsic gettering intrinsic semiconductor inversion ion ion beam ion beam lithography, IBL ion implantation ion milling ion multicharged, MCI Ion Projection Lithography, IPL ion reflection ion single charge ion sputtering, milling ionic bond ionic conduction ionization ionization energy IPA drying IPL IR iron, Fe Irvin's curves isolation isopropyl alcohol, IPA isotropic etch ITO
J
JBS JFET junction junction depth junction, p-n
K
k Kaufman source killer defect Kirk effect KOH KrF excimer laser
L
lamp cleaning lamp heating Langmuir-Blodgett film, LASCR laser heating laser interferometry LASER, laser latch up, latchup, latch-up lateral diffusion lateral etching lateral transistor LATID lattice lattice constant , a lattice matched structure lattice mismatch LCC LCD LDD LDMOS LDMOSFET leadframe leak leak detector leakage current LEC LED, Light Emitting Diode LEED LER LET, lifetime, liftoff, lift-off, process light emmiter lighting, semiconductor lighting, lightly doped drain, LDD limited-source diffusion line defect lithography LOCOS logic circuit long-range order LOP low energy implantation low pressure oxidation low-high, l-h, junction low-k dielectric low-pressure mercury (Hg) lamp LPCVD LPD LPE LSMCD LSTP LTE LTO
M
magnetic CZ, MCZ magnetic semiconductor, magnetically confined plasma magnetron magnetron sputtering majority carriers Marangoni drying mask mask, photolithography mask, X-ray lithography maskless lithography, mass action law, mass flow controller, MFC mass spectroscopy Maxwell-Boltzmann distribution MCZ mean free path mechanical mask megasonic agitation, megasonic scrubbing megasonic cleaning memory structure, cell MEMS MEMS release mercury probe, MERIE MESA MESC port MESFET metal metal MOS gate metallic bond metallic contaminant metallization metallurgical junction metallurgical junction metal-semiconductor contact MFMISFET micrometer, micron microprocessor microwave plasma, MW plasma mil Miller indices MIM MIMIC, MMIC minienvironment minority carriers MIS MISFET mist deposition MNOS mobile charge mobility MOCVD MODFET, modulation doping, MOEMS Molecular Beam Epitaxy, MBE molecular bond molelectronics molibdenum silicide, MoSi2 monolithic IC Moore's law MOS gate, MOS, Metal Oxide Semiconductor MOSFET MOST MPGA MPS MTBF MTL MuGFET. Multi-gate FET Multichip Module, MCM multicrystalline material multilayer metallization multilayer resist multilevel interconnect, MLI multilevel metallization
N
n, refractive index NAA nanocrystal quantum dot, NQD, nanodot nanoglass nanoheteroepitaxy, NHE nanometer, nm nanoporous silica nanotechnology nanotechnology, conventional nanotechnology, new generation nanotube nanowire native oxide NBTI, negative charge dielectric negative resist negative resistance NEMS NGL, Next Generation Lithography nickel silicide, NiSi nitric oxide, NO nitridation nitrided oxide nitrogen, N2 nitrous oxide, N2O NMOSFET NO, N2O oxidation non-contact electrical characterization non-radiative recombination non-selective etching non-volatile memory normally "off" MOSFET normally "on" MOSFET NTD n-type semiconductor nucleation numerical aperture, NA
O
OBIC OEM OFET ohmic contact OLED omega gate, OMVPE ONO opaque material Open-circuit voltage OPL optical emission spectroscopy, OES optical interconnects optical lithography organic contaminant organic LED, OLED organic semiconductor organic solvent organic TFT, OTFT OSC OSF OSQB outdiffusion overlay oxidation constants oxidation kinetics oxidation mask oxide oxide breakdown oxide etching oxide fixed charge, Qf oxide mobile charge, Qm oxide trapped charge oxygen in silicon ozonated water ozone
P
package packaging PAL parallel plate reactor Partially- Depleted SOI, PDSOI particle particle counter particle removal passivation passive element, pattern definition pattern generation, generator Pauli exclusion principle PCM, PCRAM PDIP PDP PEEM pentacene permittivity of vacuum phase shift mask, PSM phase shifter, PHEMT pHEMT phonon phophorescence, phosphine, PH3 phosphorus tetrachloride, POCl3 phosphorus, P phosphosilicate glass, PSG photocurrent photocurrent Photo-CVD photodetector photodiode photoelectric effect photoemulsion photoemulsion mask photolithography, optical lithography photomask photon photonic device photoresist photoresistor photostabilization of resist phototransistor photovoltaic effect, photovoltaics, physical etching Physical Liquid Deposition. PLD Physical Vapor Deposition, PVD physisorption pi gate, PIC, piezoresistivity, Pin Grid Array, PGA p-i-n junction, PIN pinhole pionics, Piranha clean pitch planar CMOS planar defect planar process planar transistor planarization planarizing resist Planck constant, h plane channeling, plasma plasma anodization Plasma Enhanced Chemical Vapor Deposition, PECVD plasma etching Plasma Immersion Ion Implantation, PIII plastic ICs platinum silicide, PtSi PLCC PLED plug PMMA PMOLED PMOSFET p-n junction p-n junction isolation POA POCL point defect Poisson equation polar semiconductor POLED polishing polprzewodnik poly - Si gate poly depletion polycrystalline material, poly polycrystalline silicon, poly Si Poole - Frenkel conduction Poole-Frenkel emission POR, porous dielectric positive charge dielectric positive resist post-CMOS post-CMP cleaning post-implant anneal potential barrier POU power - delay product power device ppb ppm PRE pre-damage implants predeposition preferential etching pressure units PREVEIL process diagnostics process monitoring progressive breakdown projected range projection printing PROM protocrystalline material' proximity effect proximity printing pseudomorphic material p-type semiconductor puller Pulsed Laser Deposition, PLD, PUT PV PVD PZT
Q
Qbd QD LED, QFP, quad package, quantum device quantum dot quantum efficiency quantum well quartz quasi-Fermi level quasistatic C-V
R
radiant heating radiation wavelength - energy conversion radiative recombination Radio Frequency, RF, plasma raised source-drain RAM ramp voltage oxide breakdown, Ebd Rapid Thermal Processing, RTP raster scan Rayleigh equation, RBS RCA RCA-1, RCA1, RCA 1 RCA-2, RCA2, RCA 2 reactive evaporation Reactive Ion Etching, RIE reactive sputtering recombination recombination center, recombination current recombination lifetime recombination site rectifying contact redistribution refractive index, n regioregular polythiophene release process remote plasma, downstream plasma resist resist ashing resist stripping resistivity resolution resonant tunneling reticle retrograde gate retrograde well reverse bias reverse breakdown voltage, RF RGA RHEED RIBE rinsing R-metal MOS gate RMOS R-MOSFET RMS roll-off roll-to-roll process, R2R, ROM Roots pump rotagoni drying rough, roughing, pump roughness RTA RTC RTCVD RTN RTO RTP RTS
S
SACVD SALICIDE process SAM (Auger) SAM (Monolayer) SAMOS sapphire saturation current SC-1, SC1, SC 1 SC-2, SC2, SC 2 scaling rules SCALPEL Scanning Electron Microscopy, SEM Scanning Tunneling Microscopy, STM scattering sccm Schottky barrier Schottky clamped transistor Schottky defect Schottky diode Schottky effect Schottky emission Schrodinger equation SCR screw dislocation, scrub, scrubbing SCS SDHT Secco etch seed crystal SEG segregation coefficient, m SEL , Surface - Emitting Laser Selective Area Chemical Vapor Deposition, SACVD selective epitaxy selective etching selective exposure SELED , Surface- Emitting LED semiconducteur semiconductor semiconductor device semiconductor diode semiconductor laser semiconductore semi-insulating semiconductor series resistance shadow mask shadowing effect shallow junction shallow trench isolation, STI sheet resistance Shockley - Read - Hall theory short-channel effects short-circuit current silane, SiH4 SILC silicidation silicide, silicides silicon carbide, SiC silicon dioxide, SiO2 silicon dopants silicon etch silicon germanium, SiGe silicon nanowire, SiNW silicon nitride, Si3N4 silicon oxidation silicon oxynitride silicon precursor silicon tetrachloride, SiCl4 silicon, Si silicon-silicon dioxide, Si-SiO2, system SiLK SIMOX, SIMS single charge ion single-chip module single-crystal, single-crystal material single-wafer cleaning single-wafer process SiNW SIP SIPOS Sirtl etch slicing slurry small-signal Smart Cut ™ SMIF SMIF box, SMIF pod SMOLED SOAN SOC SOD sodium, Na soft bake soft breakdown soft lithography, SOI, Silicon-on-Insulator solar cell Solid State Light Source, SSLS, solid-phase crystallization, SPC solid-phase epitaxy, SPE, solid-solubility limit SOM sonic wave SONOS, SOS, Silicon-On-Sapphire source source-drain engineering space charge region spacer SPC spectroscopic ellipsometry, SE SPICE spiking spin cleaning spin drying spin-on deposition, spin coating spin-on glass, SOG spintronics SPM spontaneous emission spray cleaning spray deposition spreading resistance spreading resistance profiling sputter yield sputtering target sputtering, sputter deposition sputtering, sputter etching SRAM SRD SRH SRO SSI sSOI, stacking fault Staebler - Wronski effect static charge steam oxidation step and repeat projection stepper STI stimulated emission STM STO storage capacitor storage time straggle strain, biaxial, strain, uniaxial, strained - layer quantum-well device strained film strained layer supperlattice, SLS strained silicon stress stressor stripping strong inversion sub-collector contact suboxide substitutional substitutional diffusion substrate injection subthreshold region supercritical cleaning supercritical CO2 , SCCO2 supercritical fluid superlattice SUPREM surface amorphization surface analysis surface charge surface charge analysis surface cleaning surface conditioning surface damage surface dopant concentration Surface Emitting Laser, SEL Surface Emitting Light Emitting Diode, SELED surface mount technology, SMT surface orientation surface passivation Surface Photovoltage, SPV surface potential surface recombination surface recombination velocity surface roughness surface state surround gate SWAMI SWCNT, SWI SWP synchrotron radiation
T
TAB TaN tantalum carbide, TaC, tantalum pentoxide, Ta2O5 tantalum silicide, TaSi2 tantalum, Ta target TCA TCE TCO TDDB TD-GC-MS TED TED(iffusion) TED(iode) TEM TEOS TeraHertz Transistor ternary semiconductor TFT, Thin Film Transistor thermal budget thermal conductivity thermal evaporation thermal oxidation, thermal oxide thermionic emission thin film three-demensional (3-D) integrated circuits threshold adjustment threshold voltage,VT through silicon via, TSV, thyristor Time-Dependent Dielectric Breakdown, TDDB Time-Zero Dielectric Breakdown, TZDB titanium nitride, TiN titanium oxide, TiO3 titanium silicide, TiSi2 titanium sublimation pump titanium, Ti TOF-SIMS, TOFSIMS top-down processing Total Reflection X-Ray Fluorescence spectroscopy, TXRF transconductance transient enhanced diffusion, TED transistor transistor leakage Transit-Time Diodes transverse straggle trap, TRAPATT diode trench trench capacitor trench isolation trivalent silicon TSV, TTF TTL tungsten silicide, WSi2 tungsten, W tunnel oxide tunneling, tunneling current TUNNET turbomolecular pump TXRF
U
UHV UJT ULSI ultrasonic agitation, ultrasonic scrubbing ultra-thin oxide Ultra-Thin Silicon on Sapphire, UTSOS U-MOSFET, UMOS undercut uniaxial strain, unipolar device unipolar transistor unlimited source diffusion unsaturated bond UPS USJ UV cleaning UV, ultraviolet UV/Cl2 UV/ozone
V
vacancy vacancy vacuum level, vacuum pump, valence band Van der Pauw method van der Waals force varactor variable shape beam varistor VCSEL VDMOSFET vector scan velocity overshoot velocity saturation vertical channel vertical diffusion vertical furnace vertical transistor Vfb roll-ff VHSIC via via veil VLS growth VLSI V-MOSFEF, VMOS volatile memory volume defect VPD VPD - AAS VUV
W
wafer wafer bonding wafer charging wafer diameter wafer fabrication wafer flat Wafer Scale Integration, WSI wafer track wafer warpage wafer-level packaging, Weibull plot well wet bench wet cleaning wet etching wet oxidation wetting angle WF wide bandgap semiconductor wire bonding work function work function difference WSI Wurtzite structure
X
XPS X-ray diffraction X-ray Fluoroescence, XRF X-ray lithography X-ray mask X-ray resist
Y
yield yield ramping
Z
Zener diode Zener effect Zener tunneling Zerbst plot zeta potential zinc blend lattice zinc oxide, ZnO Zinc sulfide, ZnS zirconium silicate, ZrSiO4 zirconuim oxide, zirconia, ZrO2 Z-RAM
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