|
|
|
10.2. Wafer Dicing
Once on-wafer testing of each and every chip is completed, wafer can be separated into individual chips in the course of the process commonly referred to as wafer dicing. In semiconductor manufacturing, depending on the material wafer is made out of and its thickness, dicing is implemented by (i) scribing along selected crystallographic planes and breaking, (ii) cutting using high precision diamond blade, (iii) cutting using laser.
This section is still under construction
References
|
| Created and operated by J. Ruzyllo. Copyright © J. Ruzyllo 2007. All rights reserved.
|
|
|
