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10. FROM PROCESSED WAFER TO PACKAGED DEVICE
The end product of the semiconductor fabrication process is a wafer with hundreds of identical chips, each containing a complete discrete device or an integrated circuit, proceesed into its near surface region. This section of the Guide is concerned with a series of operations which are performed to transform the wafer into the fully tested, assamblied, and packaged devices ready for shipment.
THIS SECTION IS STILL UNDER CONSTRUCTION
References
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