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6.1. Lithographic Process
The lithographic process engraves desired pattern on the surface of the solid substrate (see introduction in section 6). In semiconductor manufacturing a pattern transfer material called "resist" is used for this purpose. Upon selective (localized) irradiation, the chemical structure of the resist is altered in such way that it becomes soluble, or non-soluble in the developer solution. The key element of the process is a wavelength of radiation used to expose the resist. The most common process of photolithography, or optical lithography, uses UV light for this purpose. Alternative, non-optical, lithographies use either electron beam, e-beam lithography, EBL, or X-rays X-ray lithography for the same purpose. According to an important general rule shorter the wavelengths of the irradiating medium, higher the resolution of the pattern transfer process (i.e. smaller geometries can be delineated on the wafer surface).
An entirely different approach which also has a potential for patterning features in sub-50 nm range is nanoimprint lithography.
This section is still under construction
References
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