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5.2. Deposition Techniques
In this section processes forming a thin film from the components supplied from outside (i.e. substrate is not chemically involved in the interactions resulting in the film formation) are considered. Thin film deposition techniques in question can be classified in the variety of ways. One way is to distinguish between those in which chemical reaction(s) are involved in the film formation (CVD methods in Section 5.2.2.)and those based solely on the physical interactions (PVD in section 5.2.1 and PLD in section 5.2.3). Furthermore, consideration can be given to the state of the source material used. In the case of CVD methods it can be either gas or liquid, but in the case of PVD it is only a solid while in the case of PLD methods only a liquid. Respective sections consider these issues in greater detail. Process of electroplating (section 5.2.4) escapes this classification and should be considered separately.
Suggested search words: thin film deposition, film nucleation, mechanism of thin film formation
References
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