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5. THIN FILM DEPOSITION
As discussed in section 2.3, material deposition (additive porcesses)is key a operation in any semiconductor device fabrication scheme. The thickness of deposited films in semiconductor fabrication is typically below 1 micrometer. Thus, those films are commonly depicted as "thin". In this section thin-film deposition technology employed in semiconductor fabrication is considered both from the point of view of growth mechanisms involved as well methods of implementation of the deposition process.
From the point of view of the origin of components of the thin film, deposition techniques can be devided into those in which all components comprising the film are delivered from the external sources (methods considered in Section 5.2) and those in which one cpmponents originates from the substrate on which film is being formed (methods considered in Section 5.3). A special case in thin film technology is epitaxial deposition which single-crystal thin film is formed on the single-crystal substrate.
Suggested search words: thin film, thick film, nucleation
References
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