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4. SURFACE CLEANING
During semiconductor device processing it is virtually impossible to entirely shield wafer surface from contaminants commonly encountered in process environment. Therefore, in order to achieve satisfactory manufacturing yield, wafers in the course of device manufacturing are frequently subjected to carefully implemented surface cleaning operations. In fact, wafer cleaning has become one of the most critical and the most often applied operations in the fabrication of semiconductor devices, especially advanced ultra-high packing density silicon integrated circuits.
This chapter reviews cleaning methods used in semiconductor fabrication.
References
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