|
|
|
2.3. Semiconductor Fabrication Processes
Typically, fabrication of all semiconductor devices, either simple diodes or complex integrated circuit, is carried out following strictly executed sequence of operations that are performed on the piece of semiconductor material shaped as a thin, circular wafer (see section 3).
Each wafer in the course of device fabrication is subjected to a series of repetitious operations (several hundreds operations in the case of complex integrated circuit). All operations performed before first contact deposition are referred to as front-end-of-line (FEOL) processes while all remaining in the sequence are referred to as back-end-of-line (BEOL) processes.
Suggested search words: wafer cleaning, thin film deposition, photolithography, etching, semiconductor doping, metal-semiconductor contacts, IC packaging.
References
|
| Created and operated by J. Ruzyllo. Copyright © J. Ruzyllo 2007. All rights reserved.
|
|
|
