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2.2.2. Non-Planar Devices
The non-planar, 3D semiconductor devices are becoming more common, and thus, peculiarities of the 3d device manufacturing should be noted. Fabrication of non-planar devices uses the same methods as fabrication of planar devices, but the processing of vertical surfaces and/or deep etched features are emphasized in 3D device processing. Two distinct classes of such devices include MEMS (Micro-Electro-Mechanicl Systems) and a new generation of MOSFETs exemplified for instance by the FinFET structure.
Even more radical departure from device planarity is encountered in essentially one-dimensional devices built using structures such as nanowires and nanotubes.
Suggested search words: MEMS, FinFET, surround gate transistor, double gate transistor
References
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| Created and operated by J. Ruzyllo. Copyright © J. Ruzyllo 2007. All rights reserved.
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