Partners SemiZone Knowledge on Demand http://www.semizone.com/ Primaxx Leadership in HF vapor-phase MEMS etch release http://www.primaxxinc.com/ Hattori Consulting International Hattori Consulting International http://members2.jcom.home.ne.jp/ t.hattori	Click on any topic below to obtain the desired information.      1.  INTRODUCTION      2.  KEY CONCEPTS          2.1.  Semiconductor Materials          2.2.  Semiconductor Devices              2.2.1.  Planar devices              2.2.2.  Non-Planar Devices          2.3.  Semiconductor Fabrication Processes          2.4.  Fabrication Schemes          2.5.  Environment and Tools              2.5.1.  Cleanroom              2.5.2.  Vacuum equipment              2.5.3.  Energy to stimulate processes      3.  SUBSTRATES          3.1.  Wafer Fabrication          3.2.  Engineered Substrates              3.2.1.  Gettering              3.2.2.  Epitaxial extension              3.2.3.  Wafer bonding              3.2.4.  Silicon-on-Insulator, SOI              3.2.5.  Strained layers          3.3.  Substrates Other Than Semiconductor Wafers      4.  SURFACE CLEANING          4.1.  Contaminants          4.2.  Wet cleaning          4.3.  Dry cleaning          4.4.  Supercritical fluid cleaning          4.5.  Surface Conditioning      5.  THIN FILM DEPOSITION          5.1.  Epitaxial and Non-Epitaxial Deposition          5.2.  Deposition Techniques              5.2.1.  Physical Vapor Deposition, PVD              5.2.2.  Chemical Vapor Deposition, CVD                  5.2.2.1.  CVD methods                  5.2.2.2.  Atomic Layer Deposition, ALD              5.2.3.  Physical Liquid Deposition, PLD              5.2.4.  Electroplating          5.3.  Oxide Formation by Oxidation              5.3.1.  Thermal oxidation of silicon              5.3.2.  Other oxidation techniques          5.4.  Thickness Measurements      6.  PATTERN DEFINITION: LITHOGRAPHY          6.1.  Lithographic Process          6.2.  Optical Lithography (Photolithography)              6.2.1.  Exposure techniques and tools              6.2.2.  Photomasks              6.2.3.  Photoresist          6.3.  Non-Optical Lithographies      7.  PATTERN DEFINITION: ETCHING          7.1.  Basic Concepts          7.2.  Wet Etching          7.3.  Dry Etching          7.4.  Post-Etching Processes      8.  SELECTIVE DOPING          8.1.   Dopants and Doping          8.2.  Diffusion              8.2.1.  Diffusion in solids              8.2.2.  Doping by diffusion          8.3.  Ion Implantation              8.3.1.  Principles of ion implantation              8.3.2.  Technology of ion implantation          8.4.  Monitoring of Doping      9.  CONTACTS AND INTERCONNECTS          9.1.  Function and Required Properties          9.2.  Materials              9.2.1.  Metals              9.2.2.  Polycrystalline silicon              9.2.3.  Silicides          9.3.  Multilevel Metallization          9.4.  Inter-Level Dielectrics          9.5.  Chemical-Mechanical Planarization     10.  FROM PROCESSED WAFER TO PACKAGED DEVICE         10.1.  On-Wafer Testing         10.2.  Wafer Dicing         10.3.  Chip Attachment and Interconnecting         10.4.  Package Types and Packaging Process Created and operated by J. Ruzyllo. Copyright © J. Ruzyllo 2007. All rights reserved.