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Sunday, August 15, 2021

#476 Thirty years ago: August 1991


Precise measurements of temperature of wafers subject to thermal treatments in the course of semiconductor device manufacturing was always a challenge. Whether high-temperature oxidation or epitaxial deposition, or low-temperature anneal, whether IR heating or inductive heating, control of wafer temperature was a challenge. The challenge was particularly drastic in the case of Rapid Thermal Processing (RTP) making inroads into mainstream semiconductor manufacturing technology some thirty years ago.


In August 1991 issue of the trade magazine “Semiconductor International” challenges of wafer temperature measurement in the course of the rapid heating of processed wafers are considered and commercial RTP systems available on the market at that time compared.Type of pyrometers employed, material used to construct the reactor and its shape, as well as the way emissivity correction was implemented were the factors distinguishing between various commercial RTP tools.


Posted by Jerzy Ruzyllo at 10:23 AM | Semiconductors | Link is a personal blog of Jerzy Ruzyllo. He is Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University. With over forty years' experience in academic research and teaching in semiconductor engineering he has a unique perspective on the developments in this technical domain and enjoys blogging about it.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


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