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Sunday, March 14, 2021

#464 Non-contact, in-line, real-time RF wafer monitoring

Electrical measurements of semiconductor materials and devices have always been, and will continue to be a key characterization methodology in semiconductor device engineering. When properly applied, electrical characterization can unequivocally determine quality of material and predict performance of device to be built using this material (trust me, I know it, I used electrical characterization in my research for some  45 years)

 

A challenge in this specific application is to perform electrical characterization without contacting a product wafer, or other crystalline semiconductor material, and without any interference with its characterized surface. In other word, the challenge is to perform measurements in the totally noninvasive fashion compatible with the needs of in-line, real time monitoring of processes used to manufacture semiconductor devices.

 

New opportunities in the area are provided by non-contact, in-line, real-time method based on the use RF radiation. If interested, and may be interested in being involved in this project,  take a look at the Defect Specific Lifetime Analysis (DSLA) method described here: GEKA ASSOCIATES (gekallc.com)

 

Posted by Jerzy Ruzyllo at 08:40 PM | Semiconductors | Link



Semi1source.com/blog is a personal blog of Jerzy Ruzyllo. He is Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University. With over forty years' experience in academic research and teaching in semiconductor engineering he has a unique perspective on the developments in this technical domain and enjoys blogging about it.




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