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Sunday, June 26, 2016

#348 Characterization of semiconductor surfaces

With wafer surfaces playing key role in defining characteristics of semiconductor devices and circuits, surface characterization and monitoring processes in semiconductor device engineering are increasingly important. This includes in particular wafer cleaning operations and other surface conditioning steps that need to be closely monitored.


Methods of semiconductor surface characterization that can be used in surface processing characterization and monitoring include (i) chemical/physical surface analysis involving methods such as SIMS, XPS, TXFR, SEM, AFM, (ii) optical methods such as spectroscopic ellipsometry, FTIR and others, and finally (iii)  electrical methods which allow identification of the  surface-related electrically active centers representative of the condition of the wafer surfaces. While not qualitative the last type of methods is of particular interest as they unravel surface characteristics which are directly affecting performance of the final device.  


Posted by Jerzy Ruzyllo at 09:14 AM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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