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Sunday, March 20, 2016

#340 Reversing surface "aging"

Good news is that surface aging discussed in the previous blog can be relatively easily reversed by lamp cleaning. However, only light organic contaminants relatively weakly physi-sorbed at the wafer surface can be controlled this way. If allowed to remain on the surface for the long storage times, chemical reactions with moisture from the ambient will convert organic contaminants into heavy organic compound strongly chemi-sorged at the wafer surface. Then, only standard wet clean such as SPM or APM will be able to restore wafer surface to its original condition.

Posted by Jerzy Ruzyllo at 08:01 PM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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