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Sunday, March 13, 2016

#339 Surface "aging"

Surface contaminants encountered in semiconductor manufacturing can be  added to the surface during wafer processing and  during wafer storage. The latter concerns contaminants from the storage and shipping ambient including clean room air, containers, boxes, and cassettes. Assuming storage is taking place in a particle-free environment the contaminants originating from storage include primarily organic compounds and moisture.


Prolonged exposure to the ambient air during wafer storage results in the surface “aging” process which may interfere with subsequent processes or measurements such as ellipsometric measurements. See Fig. 3 in this paper for the illustration of the dynamics of silicon surface "aging" process as represented by the changes in the value of contact angle as a function of wafers storage time. 


Posted by Jerzy Ruzyllo at 08:13 AM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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