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Sunday, December 13, 2015

#333 IEDM 2015

As usual in December (e.g. see blogs #312 and #266) comes the time to comment on the trends that have emerged from the papers presented during the annual International Electron Device Meeting (IEDM). The 2015 edition of IEDM was a memorable one because after 60 years of alternating between Washington, D.C. and San Francisco, starting in with 2016 edition, IEDM will be held solely in  the Bay Area.  


 To me, “3D” and “flexible” were on top of the list of keywords defining this year’s IEDM. The former was tossed around not only in the reference to transistors architecture (FinFETs specifically), but also in the context of 3D integration. The latter, was used mainly in reference to the flexible substrates in display technology, wearable electronics and photonics, etc. It seems to me that it won’t be long before the term “3D flexible” will emerge as a single key word.  


Posted by Jerzy Ruzyllo at 05:50 PM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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