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Sunday, August 31, 2014

#302 Wafers not only are getting larger

Comment about Si wafers in IC manufacturing getting larger in previous blog made me think about the aspect of the increasing wafer size which often goes unnoticed.


From the process engineering perspective an important consequence of the wafers getting larger in diameter is a significantly increasing weight of the wafer. For instance, 450 mm wafer is about 4x heavier than its 200 mm predecessor (~ 200 g and ~53 g respectively). Corresponding weights of the 13-wafers batches are 689 g and ~2,600 g which from the wafer handling infrastructure perspective makes tremendous difference. Not to mention increased thickness of the larger wafers necessary to assure their mechanical stability. This element also requires major upgrading of the wafer handling robots, cassettes, etc.


Posted by Jerzy Ruzyllo at 05:50 PM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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