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Sunday, July 27, 2014

#298 Mist deposition

In blog #296 I mentioned other than spin-on physical liquid deposition methods including mist deposition. The idea behind mist deposition is to convert liquid precursor (for instance colloidal solution containing nanodots or viscous liquid such as  photoresist) into a very fine mist which is then carried by nitrogen to the deposition chamber where submicron droplets uniformly coalesce at room temperature and at atmospheric pressure on the wafer surface. The film is then subjected to thermal curing, just like a spin-coated material, and solidified.


Mist deposition has been proven useful in various thin-film formation applications including nanocrystalline quantum dot films, high-k dielectric films or photoresist.  


The method is particularly in the thickness regime below 100 nm where other PLD methods such as spin-on or microspray may not allow sufficient control over film thickness.

Posted by Jerzy Ruzyllo at 08:13 PM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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