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Sunday, June 22, 2014

#293 More on PLD

More on PLD because the pool of materials used in semiconductor technology to form thin-film using this deposition technique is growing. In general, process of physical liquid deposition forming thin-film involves application of the liquid precursor to the surface of the substrate followed by thermal curing causing vaporization of the solvent and solidification of the film. In the case of painting (see previous blog) liquid precursor (paint) would be applied using brush. Simple, right?


Well, PLD methods such as painting, brushing, screen-printing, etc. are too crude to be used in semiconductor device manufacturing where requirements regarding control over thickness and uniformity of the film are extremely stringent. The most common PLD process in semiconductor manufacturing is a process of spin-deposition of photoresist which initially in the form of a viscous liquid ends up on the surface of the wafer in the form of highly homogenous thin film.


More on the alternative PLD techniques later...

Posted by Jerzy Ruzyllo at 10:17 AM | Semiconductors | Link is the personal blog of Jerzy Ruzyllo. With over 35 years of experience in academic research and teaching in the area of semiconductor engineering (currently holding position of a Distinguished Professor of Electrical Engineering and Professor of Materials Science and Engineering at Penn State University), he has a unique perspective on the developments in this progress driving technical domain and enjoys blogging about it.

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.

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