Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
post-CMP cleaning  particularly demanding cleaning routine needed to remove products of CMP process; wet cleaning involving mechanical interactions (brush scribbing).
brush scrubbing  cleaning of semiconductor surfaces using rotating brushes; used to remove heavy residues which cannot be removed without mechanical interactions; used in post-CMP wafer cleaning.
slurry  a liquid containing suspended abrasive component; used for lapping, polishing and grinding of solid surfaces; key element of CMP processes.
wet cleaning  process of contaminants removal from the wafer surface in the liquid-phase; prevailing cleaning method in semiconductor manufacturing; wet cleaning chemistries are selected to form soluble compounds of surface contaminants; often enhanced by megasonic agitation; always followed by deionized water rinse and dry cycle.

Reference: Akrion, Inc.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.