Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
package  housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.
DIP  Dual Inline Package; common type of package used to mount and enclose semiconductor chip.
quad package,  an IC packages with leads located on four sides of the package; allows packaging of more complex devices than the DIP (Dual In-Line Package) with leads on two sides only.
Term (Index) Definition
ceramic package  package, housing a microchip, made out of ceramic material.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.