Semiconductor Glossary, Developed Semi OneSource.

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With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

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Term (Index) Definition
lateral etching  etahcing taking place in the direction parallel to the wafer surface; undesired, and hence avoided in the case when very tight vertical geometrical features are defined by etching; desired and used in select MEMS etching applications.
anisotropic etch  etch in which etch rate in the direction normal to the surface is much higher than in direction parallel to the surface; no undercutting i.e. lateral distortion of pattern is minimized; needed to define very tight geometries.
isotropic etch  etch in which rate of etching reaction is the same in any direction; non-directional.
MEMS  Micro Electro Mechanical Systems micromachined in silicon; typically integrated with electronic microcircuits; generally fall into two categories of microsensors and microactuators; depending on application operation based on electrostriction, or electromagnetic, thermoelastic, piezoelectric, or piezoresistive effect.
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Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

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Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.