Semiconductor Glossary, Developed Semi OneSource.

Check out the new weBLOG!

Semiconductor Glossary book, click here to see new prices!

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

Search For Term

Term (Index) Definition
die  a single piece of semiconductor containing entire integrated circuit which has not yet been packaged; equivalent term - chip.
chip  piece of semiconductor wafer containing the entire circuit.
Term (Index) Definition
die attachment  process of attaching die (chip) to the package.
Term (Index) Definition
die separation  process of cutting wafer into dies (chips) each containing a complete semiconductor device/circuit.
dicing  process of cutting semiconductor wafer into individual chips following completion of device (both discreet and integrated) manufacturing; in the case of large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallographic planes using high precision saw with ultra-thin diamond blade.
Hit Count=

Back To Top! 

Back To Home!

Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

Hit Count=
Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.