Semiconductor Glossary, Developed Semi OneSource.

Check out the new weBLOG!

Semiconductor Glossary book, click here to see new prices!

With over 2000 terms defined and explained, Semiconductor Glossary is the most complete reference in the field of semiconductors on the market today.


Including some 500 new terms defined and remaining terms updated and modified, a 2nd edition book version of this glossary is now available.

Search For Term

Term (Index) Definition
cleaved SOI  see "smart cut".
bonded SOI  SOI substrates formed by bonding two silicon wafers with oxidized surfaces; following bonding one wafer is polished down to the desired thickness of active layer with interface oxide becoming a buried oxide.
Smart Cut   process used to fabricate bonded SOI substrates; before bonding one wafer is implanted with hydrogen to the depth which will determine thickness of an active layer in future SOI wafer; following bonding wafer is subjected to an anneal during which implanted wafer splits along the plane stressed with implanted hydrogen - one section, very thin, remains bonded to the other wafer forming SOI substrate while the other can be re-used in th fabrication of additional SOI substrates. "Smart Cut" is a trademark of S.O.I.TEC, S.A., Grenoble, France.

Reference: See Semiconductor Notes for more information
Hit Count=

Back To Top! 

Back To Home!

Jerzy Ruzyllo is a Distinguished Professor Emeritus in the Department of Electrical Engineering at Penn State University.

This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization.

Hit Count=
Created and operated by J. Ruzyllo. Copyright J. Ruzyllo 2001-2016. All rights reserved.

Information in this glossary is provided at the author's discretion. Any liability based on, or related to the contents of this glossary is disclaimed.